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| Position：Produce Center >>> Crystal Processing Service >>> Polishing Service |
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Polishing Service
Facilities Photos:
Business:
Specifications of polishing process:
- Dimension: (W±0.1mm)x(H±0.1mm)x(L+0.2/-0.1mm)
- Bevelling: ≤0.2mm@45°
- Chipping: ≤0.1mm
- Aperature: 90% central diameter
- Flatness:λ/8 @ 633 nm, λ/4 @ 633nm(thickness < 2mm)
- Scratch / Dig: 10/ 5（MIL-PRF-13830B）
- Parallelism: better than10 arc seconds
- Perpendicularity: 5 arc minutes
- Guarantee: 1 year
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